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芯片激光散斑检测设备
    发布时间: 2019-10-15 13:50    

芯片激光散斑检测设备

Chip Laser Speckle Inspection System

芯片激光散斑检测设备，通过超声波对芯片加载，使封装后的芯片内部和外部产生加载后的形变，再通过激光剪切散斑干涉系统对芯片的形变进行缺陷检测，尤其针对芯片封装后可能出现的气泡检测。The chip aser speckle detection equipmentutilizes ultrasonic excitation to apply load on thechip,inducing post-loading deformation bothinternally and externally in packaged chips.Subsequently,the aser shearography speckleinterferometry system is employed to performdefect detection by analyzing these deformations,with particular emphasis on identifying potentialair bubble defects that may occur post-chipencapsulation.

芯片激光散斑检测设备

产品测量仪

FAST WISE OPTICS
 product measurement device


  • 产品检测仪，主要针对成品尺寸检测，具备自动对焦、自动捕捉原点、像素拼接、产品识别等多项出色功能。尤其针对产品平行度、水平度等特殊的检测，减少人为测量误差，提高检测测量效率。

  • Product tester is mainly used for the dimension of the finished product, and features excellent functions such as automatic focusing, automatic capturing of origin, splicing of pixels, product identification and so on. In particular to the special inspections such as parallelism and levelness of the product, it can reduce the man-made measurement error and improve the measurement efficiency. 


参数 Parameter

UDMP7010P

测量物
Measuring Object

塑料制品Plastic Products

拍摄芯片
 Photographing Chip

1000万像素  黑白Coms

10 Million Pixels   Black And White Coms

受光镜头
 Light Receiving Lens

双远心镜头

Bi-Telecentric Lens

照明
Lighting

同轴光

Coaxial Light

测量精度
Measurement Accuracy

0.01mm

测量范围
 Measuring Range

700 X 120 X 90 mm

测量平台

Measuring Platform

三维行程700 × 100 × 100 mm

Three-Dimensional  Travel  700 × 100 × 100 mm

存储容量及输出格式

Storage CapacityAnd Output Format

1000G、CSV

接口类型

Interface Type

USB 2.0/3.0、千兆网

USB 2.0/3.0、Gigabit Network

运行系统

Operation System

Windows

软件

Software

UDC 1.0

支持语言

Languages

中文、英文

Chinese And English

电源

Power Supply

Ac 110V Or 220V 50Hz/60Hz

使用环境温度

Working Ambient Temperature

+10 ～ 36℃

使用环境湿度

Working Ambient Humidity

20~70% Rh,无凝结

20~70% Rh,No Condensation

外观尺寸

Dimension

1100 × 710 × 1035 mm

 



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